The first serial Russian lithography system for manufacturing microchips using 350 nm technology is planned to be delivered to the customer as early as December 2026. Such equipment is needed to print the microscopic elements of future chips onto silicon wafers.

The machine is designed for the production of power and automotive electronics, as well as components for industrial equipment. It can process up to 63 silicon wafers 150 mm in diameter or up to 43 wafers 200 mm in diameter per hour.

The next stage will be the creation of a more precise Russian lithography system for producing 130 nm chips. Serial deliveries of these machines are planned to begin as early as 2027.
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